Wire guide roller (WGR) is a core part of wire saw technology to slice silicon ingot into silicon wafer in wafer fabrication industries. Regrooving and recoating process is necessary to maintain the long run and effectiveness of the WGR as the grooves will wear over time. Our technology uses an automated PU mixing machine, diamond studded cutting tools, and a highly precise computer numerical control (CNC) machine to control the tolerance level up to 2 micron. These would greatly help our customer to achieve a higher yield and better precise cutting end products.
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Regrooving & Recoating Technologies on Polyurethane (PU)